Hymmen Announces New Digital Embossing Patents in U.S., China

I4F and Hymmen announced that new Hymmen patents relating to digital embossing have been granted in the United States and China. US patent 11141759 B2 and Chinese patent CN110267813B cover methods for digitally embossing panel surfaces with varying gloss grades. Both new patents are exclusively available via an i4F license. These freshly granted Chinese and US patents provide further protection for Hymmen’s state-of-the-art digital embossing technologies on any type of panel material, the companies said. 

“Historically, Hymmen has maintained a strong IP position and the granting of these two new patents reinforces that even further," said René Pankoke, managing Partner of Hymmen. "Digital printing continues to ramp-up as it will play a crucial role in the future of modular flooring. These new technologies offer manufacturers unlimited design and embossing-in-register flexibility on a wide range of materials.”