I4F and Hymmen announced that the U.S. Patent and Trademark Office issued notices of allowance for the grant of two new Hymmen US patents. The patents (granting on applications 16/494,308 and 16/494,309) cover digital embossing technologies delivering enhanced embossed optics on panels. At the same time, Hymmen also received a patent grant from China, patent number CN110290925B, covering aspects of Hymmen’s award-winning DLEPlus digital embossing technology.
All new US and China patents are exclusively available via an i4F license and provide further protection for Hymmen’s state-of-the-art digital printing technologies on any type of panel material. Digital printing is set to play a crucial role in the future of new material flooring as it enables unlimited design as well as embossing-in-register flexibility, and can be applied to a wide range of materials. This facilitates faster response times to market demands and trends while reducing material waste.
“These latest grants add even more patent protection for those licensed by i4F to use our advanced digital printing technologies," Hymmen CEO Dr. René Pankoke. "Additionally, this further validates the novelty and effectiveness of our digital printing embossing technologies on panels in any material. Hymmen’s portfolio goes from strength to strength, capturing the newest and most exciting areas of the digital printing market space.”