Installation expert andNFTcolumnist Ray Thompson, Jr., will host a series of classes on hard surface installation and moisture-related issues in March and April. The hands-on sessions, which will be held at the Floor Covering Institute in Easton, Wash., will include a basic five-day resilient installation school, five-day commercial and advanced schools; as well as classes aimed at floor preparation and wood flooring installation. The slate will also include daylong seminars covering moisture in concrete and moisture testing classes.

Installation expert andNFTcolumnist Ray Thompson, Jr., will host a series of classes on hard surface installation and moisture-related issues in March and April. The hands-on sessions, which will be held at the Floor Covering Institute in Easton, Wash., will include a basic five-day resilient installation school, five-day commercial and advanced schools; as well as classes aimed at floor preparation and wood flooring installation. The slate will also include daylong seminars covering moisture in concrete and moisture testing classes.

Thompson said anyone “interested in a career in the flooring industry” should attend. “The classes are for students branching into the different segments of installation or just to hone their skill as they climb the ladder of installation skills,” he noted. “There are a lot of installers that are good with the rudimentary skills with their hands and just need a little guidance to become true professionals.”

He is also seeking support from manufacturers for the classes. “The toughest part of this venture is getting support from manufacturers in supplying materials, adhesives and the things necessary to keep the training costs under control,” he acknowledged. “Obviously, the more I have to purchase the greater the costs per student.”

Classes are set to begin the week of March 10th, with sessions also scheduled for “a week in April.”  For more information, call (509) 674-1565 or (425) 681-2214 (cell), fax (509) 674-7651 or e-mail rthompson@cablespeed.com.